HARDWARE·April 27, 2026Intel’s Budget Wildcat Lake Chip Beats Apple’s MacBook Neo by 27% in Multi-Core, Matches A18 Pro Single-Thread PerformanceWccftech
HARDWARE·April 27, 2026Google Is Reportedly a Major Intel Foundry Customer, Will Use EMIB Advanced Packaging for Next-Gen TPUWccftech
HARDWARE·April 27, 2026NVIDIA Taps Taiwanese Nanya Technology’s LPDDR5X Memory for Vera Rubin Platform, Offering 3x Capacity and Over 50% Bandwidth BoostWccftech
HARDWARE·April 27, 2026TSMC 3nm & 2nm Wafer Output to Be Boosted by 20% by the End of 2026 as Supply Crunch ContinuesWccftech
HARDWARE·April 27, 2026MOREFINE Crams a Desktop RTX 5060 Ti Into a $1,099 Pocket-Sized eGPU With Thunderbolt 5 and OCuLinkWccftech
HARDWARE·April 27, 202616 GB DDR5 SO-DIMM Drops by $87 in China — The First Major Price Drop This YearWccftech
HARDWARE·April 26, 2026Samsung Breaks the 10nm DRAM Barrier With New 4F Cell Structure That Boosts Density By Up to 50%Wccftech
HARDWARE·April 26, 2026NVIDIA Beats Everyone to DeepSeek V4 With Day-0 Blackwell Support, Pushing 3,500 Tokens Per Second on 1.6T ModelsWccftech
HARDWARE·April 26, 20263D X-DRAM Hits Proof-of-Concept, HBM-Replacement with 10x Density vs Traditional DRAM & High-Yield Memory DesignWccftech
HARDWARE·April 26, 2026Samsung Strike Could Deepen DRAM Crunch And Cost $20 Billion As An 18-Day Walkout Risks Becoming a 36-Day Production BlackoutWccftech
HARDWARE·April 25, 2026AMD Goes Bigger With EPYC Venice and Verano, with New SP7 and SP8 Sockets Dwarfing Today’s SP5 and SP6 PlatformsWccftech
HARDWARE·April 25, 2026Intel Rewrites Its Five-Year Desktop Gaming Roadmap to Chase AMD’s X3D Lead, Betting on Software Big TimeWccftech
