Google Is Reportedly a Major Intel Foundry Customer, Will Use EMIB Advanced Packaging for Next-Gen TPU

Google is reportedly planning to use Intel Foundry’s EMIB advanced packaging for its next-generation TPUv8e AI chip.

Other TPU variants are still expected to rely on TSMC’s CoWoS packaging and partners such as MediaTek and Broadcom.

Intel has not confirmed the customer, but the report suggests growing momentum for its foundry business.

A Google design win would boost Intel Foundry’s credibility in AI chip packaging and diversify the supply chain beyond TSMC.