TSMC 3nm & 2nm Wafer Output to Be Boosted by 20% by the End of 2026 as Supply Crunch Continues

TL;DR AI
2 min readKey summary
TSMC plans to expand advanced-node capacity to meet surging AI-related demand.
3nm output is expected to reach 180,000 wafers per month, while 2nm nears 100,000 by the end of 2026.
The company warns shortages at leading-edge nodes may persist into 2027 as major customers keep ordering more chips.
The expansion underscores how AI hardware demand is tightening supply across the semiconductor industry.

