AMD's Next-Gen Zen 7 "Grimlock" CPUs to Use TSMC 1.4nm Process Technology and FOPLP Packaging, Launching in 2028

AMD is reportedly laying the groundwork for Zen 7 “Grimlock” CPUs, with a possible 2028 launch.

The chips are said to target TSMC’s A14 1.4nm process and may use Powertech fan-out panel-level packaging.

AMD is also expected to update 3D V-Cache and add more server-focused features.

If true, the roadmap could deliver a major leap in performance and efficiency, sharpening competition with Intel.