Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint

Huawei unveiled 61.44TB and 122.88TB enterprise SSDs for AI inference and data centers.

The drives use die-on-board packaging to fit more NAND dies on the PCB and bypass limits on advanced 3D NAND sourcing.

By relying on domestically available NAND chips, Huawei is reshaping storage hardware to keep scaling under U.S. sanctions.

The move could bolster China’s domestic AI and data-center supply chain while reducing dependence on foreign chip technology.