TSMC Joins Applied Materials at $5B Silicon Valley Hub to Crack the 3D Transistor Wall Slowing Down Advanced AI Chips

Applied Materials announced a collaboration with TSMC at its new EPIC Center in Silicon Valley.

The two companies will co-develop materials, equipment, and process technologies for next-generation logic chips.

The work focuses on 3D transistors, interconnect structures, and other scaling challenges for AI chips.

The goal is to move advanced semiconductor research into high-volume manufacturing faster and more efficiently.