China Advanced Packaging Enters New Wave of Investment as 400 Billion Yuan in Projects Target Chiplet 3D Integration and AI Chip Substrates

China’s advanced packaging sector saw nearly 10 new project announcements from May to July 2026, totaling about 400 billion yuan.

Investment is concentrated in 2.5D/3D integration, Chiplet, fan-out, RDL, flip-chip, memory, and automotive packaging.

Major players and projects span JCET, Huatian Technology, Biwin Storage, and others across Shanghai, Nanjing, Shaoxing, Chengdu, and the Greater Bay Area.

The surge reflects China’s effort to build higher-end packaging capacity for AI, HPC, HBM, and autos, while reducing reliance on lower-value assembly.