TSMC Now Pays Its Biggest Customer NVIDIA, Pulling CUDA-X Into the Fab to Slash Lithography Costs by Up to 50%

TSMC is adopting NVIDIA’s CUDA-X stack and AI models across chip design and fab operations.

The tools are being used for tasks like lithography, transistor simulation, process control, scheduling, and defect inspection.

NVIDIA says the approach can reduce lithography costs, speed up simulation and inspection, and improve manufacturing efficiency.

The goal is to boost yield and help advanced fabs run more effectively.