Intel is in talks with Google and Amazon to power AI chips with new packaging tech

Intel has made advanced packaging a core part of its manufacturing strategy and sees it as a differentiator.

Intel currently uses EMIB to link chiplets; Foveros provides 2.5D/3D die-stacking capabilities.

A new EMIB-T adds through-silicon vias (TSVs) to the bridge to improve power delivery and signal integrity.

Intel repurposed Fab 9 and Fab 11X in Rio Rancho for advanced packaging lines, supported by $500 million from the US Chips Act.

Intel is in talks with Google and Amazon about advanced AI chip packaging; executives forecast packaging revenue well north of $1 billion.