Report: Intel offers overtime pay to speed up Ohio fab construction, EMIB-T packaging yield nears 90% - IT Home

Intel is reportedly offering generous overtime bonuses to speed construction at its large Ohio fab campus.

The company is targeting 14A process volume production by 2031 as part of its next-generation manufacturing roadmap.

Its EMIB-T advanced packaging work is also progressing well, with package yield nearing 90%.

However, substrate yield is still around 50%, creating a key bottleneck for scale-up and commercialization.