Shanghai Aishengna: The Secretive Company Behind China’s Latest DUV Lithography Push Thoroughly Unmasked, As Beijing Hedges With Glass Substrates And An EUV Prototype

China is accelerating efforts to localize semiconductor tools, led by a new DUV immersion lithography push.

A report identifies Shanghai Aishengna, a Shanghai Electric subsidiary linked to SMEE, as a key player behind the effort.

Huawei and partners are reportedly preparing glass substrate production for chips with a 2027 target.

A separate claim says China has an EUV lithography prototype under development, with production aimed for 2028.

Together, these moves could reduce reliance on restricted foreign equipment and materials for advanced chips.