How Huawei Discovered a Hidden Loophole in Moore’s Law

Huawei unveiled “logic folding,” a chip design that stacks layers vertically with Through-Silicon Vias instead of relying only on smaller transistors.

The company says the approach can raise transistor density by 53% and improve energy efficiency by 41%.

If it works at scale, it could help push AI and high-performance computing chips beyond some of Moore’s Law’s limits.

Key hurdles remain, especially heat dissipation, alignment, and manufacturing complexity.