Intel-Backed “Glass Substrates” Tech Will Be Ready For Commercialization Within Three Years, Says Amkor Lead

Amkor says Intel-backed glass substrates for advanced chip packaging are gaining technical stability.

The company expects the technology could be commercialized within about three years.

Intel is developing the approach as a possible successor to current advanced packaging methods.

If successful, glass substrates could help address cost, heat, and warping limits and offer a CoWoS alternative for AI chips.