TSMC Concedes Intel’s EMIB Packaging Is a Potent Contender, Starts Building “Quasi-EMIB” as CoWoS Remains Choked Through 2026

TSMC is reportedly working with Kinsus on a new EMIB-like packaging approach, described internally as a quasi-EMIB.

The move appears designed to ease heavy CoWoS backlog and reduce dependence on CoWoS-L’s RDL-based structure.

Advanced packaging is crucial for AI and high-performance chips, and CoWoS bottlenecks could constrain supply through 2026 and beyond.

If successful, the new approach could expand capacity, shorten lead times, and help TSMC better compete with Intel.