Domestic TGV Glass Substrate Industry Explodes: Chinese Manufacturers Race to Scale Through-Glass Via Technology as AI Chip Packaging Demands New Substrate Solutions

Chinese makers are rapidly expanding through-glass via (TGV) glass substrate capacity for AI chip packaging and other advanced semiconductor uses.

Domestic suppliers are scaling production lines and tooling for glass substrates and interposers, with some aiming for volume output by 2027.

TGV glass substrates can help relieve a key advanced packaging bottleneck by enabling denser, more stable, high-frequency chip interconnects.

The buildout could strengthen China’s semiconductor supply chain and support demand from AI accelerators, HBM-related packaging, and chiplet designs.