MediaTek Accepts Both Intel and TSMC Packaging as AI Chip Boom Reshapes Semiconductor Supply Chains

MediaTek said it supports both TSMC’s CoWoS and Intel’s EMIB for custom AI chip designs.

The company may work on custom AI chips for Google and other customers as demand for AI ASICs rises.

MediaTek also raised its 2026 data-center revenue outlook and aims for a meaningful share of the custom AI chip market.

Backing both packaging paths could help MediaTek ease supply-chain bottlenecks and compete more broadly in AI hardware.