Bibo Semiconductor Completes Series A+ Funding, Cumulative Financing Surpasses 900 Million Yuan

Bibo Semiconductor completed its Series A+ financing, bringing cumulative funding to more than RMB 900 million.

The round drew participation from local state-backed platforms including Wuhan Hi-Tech Investment, Chengdu Future Venture Capital, and Jiande State-owned Capital, as well as several strategic investors.

The new capital will support communication chip capacity expansion, product iteration, and market development.

It also backs R&D and commercialization for 4G/5G, NR-NTN, multimode integration, and 6G-related technologies.