Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law

Huawei says its new LogicFolding design and “Tau Scaling Law” can raise transistor density and power efficiency without EUV lithography.

The company says it has been refining the approach for years and will first apply it to upcoming Kirin smartphone chips, including the Mate 90 line.

Huawei also claims the framework could reach 1.4nm-class density by 2031, despite ongoing U.S. semiconductor sanctions.

If successful, the method could help China narrow the gap with TSMC, Nvidia-linked AI hardware, and other leading chipmakers while reducing reliance on restricted equipment.