Sihe Micro Secures New Funding to Advance Wafer Bonding Equipment

Sihe Micro secured new funding to advance its wafer bonding equipment development.

At Huawei's TECH Cares Forum Yang Chaobin said Huawei has connected 170 million people in remote areas across more than 80 countries.

Huawei exceeded its 2022 ITU P2C pledge to connect 120 million people by 2025 and highlighted programs like Skills on Wheels.

Forum participants discussed expanding rural connectivity, digital skills training, and multi-stakeholder collaboration.