TSMC Maps Out A13 “1.3nm” and A12 “1.2nm” Nodes for 2029, Sidesteps ASML’s Priciest EUV Tools for Now

TSMC extended its process roadmap through 2029, adding A13 and A12 nodes beyond its next-generation 2nm-era plans.

The company also highlighted N2U and new advanced packaging options, including CoWoS, SoIC, and co-packaged optics for AI and HPC chips.

TSMC said it will hold off on ASML’s most expensive EUV systems for now, citing cost concerns.

The roadmap signals how TSMC plans to keep pushing performance for mobile, AI, and high-performance computing while balancing tool economics.