SK Hynix is embedding cooling into HBM memory to prevent AI chips from overheating

SK Hynix unveiled iHBM, a new HBM packaging approach that embeds cooling structures into the memory interface layer near the D2D PHY.

The design uses electrically isolated, thermally conductive Integrated Cooling Elements to cut thermal resistance by more than 30%.

By reducing heat at the memory-to-processor interface, iHBM aims to limit throttling and improve sustained AI chip performance.

SK Hynix says the method can fit into existing packaging flows such as MR-MUF and silicon interposer processes, easing adoption.

If successful, iHBM could help future HBM generations like HBM5 scale to higher performance without overheating.