SK hynix builds innovative cooling solution inside a 3D stacked memory chip

SK hynix introduced iHBM, a 3D-stacked HBM design with embedded cooling elements to address heat in dense AI memory chips.

The company says the thermally conductive, electrically insulating insert can create an extra heat-dissipation path in the hottest part of the stack.

SK hynix claims the approach can cut thermal resistance by about 30% and is compatible with its mass-production packaging process.

The technology is aimed at next-generation HBM products, including HBM5, as AI servers push memory stacks higher and faster.