Taiwan adopts US firm’s chipmaking system that prints circuits without photomasks

National Tsing Hua University has selected Multibeam’s MBX multi-column electron-beam lithography platform for advanced semiconductor research and process development.

The deal marks Multibeam’s first deployment in Taiwan, with installation planned at the College of Semiconductor Research and delivery expected in 2027.

By bringing maskless chip patterning into Taiwan’s research ecosystem, the system could speed prototyping, chip integration, and advanced packaging work.