OpenAI Patent Reveals Custom AI Chip With 20 HBM Stacks, Using Intel EMIB-Style Bridges to Smash Current Limits

OpenAI disclosed a patent for a chiplet-based AI processor that uses embedded logic bridges to connect multiple compute chiplets and up to 20 HBM stacks.

The design pushes HBM placement farther from the compute dies, relaxing today’s tight packaging constraints.

If built, it could deliver much higher memory capacity and bandwidth for large AI workloads.

The approach resembles advanced packaging ideas such as Intel’s EMIB and EMIB-T.