SK hynix Verifies 12-Die Hybrid Bonded HBM Stack, but Won’t Disclose Yield Figures as Next-Gen HBM4 AI Memory Race Heats Up

SK hynix said it has verified a 12-layer HBM stack using hybrid bonding, a bump-free packaging method aimed at improving speed and thermal performance.

The company did not disclose yield figures, but said readiness for mass production has progressed.

Until hybrid bonding is fully ready, SK hynix will continue using MR-MUF for HBM packaging.

The advance underscores the race to build denser, faster HBM for AI and data center chips, where packaging and yield remain key constraints.