Intel Places Huge Order for Equipment Related to Advanced Packaging Production, Signaling Strong Interest in EMIB

Intel has placed a large order for advanced packaging and testing equipment from Taiwanese suppliers to expand EMIB capacity.

The new equipment is expected to arrive in the second half of 2026, supporting production growth in Oregon and Vietnam.

The expansion points to Intel’s push to scale advanced packaging for AI chips and strengthen its position against TSMC’s CoWoS.

Rising demand from customers such as Google, OpenAI, and NVIDIA is helping drive the broader packaging capacity race.