Will SbS, which has been giving other smartphone makers headaches, become Samsung’s ace?-36Kr

A report says Samsung may use 2nm SF2P process and SbS side-by-side packaging for its next in-house flagship SoC, Exynos 2700.

SbS places the SoC and memory horizontally next to each other, which could shorten signal paths and improve bandwidth and thermal performance.

The approach may give Samsung tighter control over packaging, memory, and chip design across the supply chain.

If adopted, it could boost the competitiveness of Samsung’s high-end mobile chips and reshape advanced packaging rivalries.